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Dedication to Innovation by ##AMD¹⁴
Usually, AMD leads the way in innovation; their work on the X3D processors is not an exception¹⁴. Representing AMD, Donny Woligroski said the company has fantastic ideas for the next X3D chip¹⁴ and is not simply resting on laurels.
Improving the 3D V-Cache¹⁴
Among AMD’s primary focuses is the 3D V-Cache¹⁴. To make the 3D V-Cache even more outstanding, AMD is now creating “very cool differentiators,” Woligroski remarked1. There are many possibilities even if he did not specify exactly how they want to improve it.
Potential Locations of Improvement¹⁴
One area of improvement might be the chiplet approach AMD uses. Currently, only one of the dies on a 16-core CPU like the Ryzen 9 7950X3D uses the additional cache¹⁴. This has produced circumstances when less expensive versions with a single die may outperform more expensive ones with two dies¹⁴.
Possibility of Extra Cache ¹⁴
Still alternative way is simply stuffing more cache¹⁴. Since AMD promotes artificial intelligence in laptops and features integrated graphics on its desktop CPUs, more cache would definitely be useful. Graphics and artificial intelligence needs are voracious for memory; so, if AMD can speed up these tasks using additional cache close to the CPU, it would hurry things1⁴.
The X3D Chips¹²⁴AMD Future
These developments will allow X3D CPUs of AMD to change the computing environment¹⁴. Reports state that the company plans to release its new line of Ryzen 9000 X3D CPUs in September 2024²; the chip maker promises that the 3D V-cache will be “even better” than on its current array of X3D CPUs. One thing is certain as we wait for further details: AMD’s inventiveness is pushing the envelope of performance¹⁴.
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